january 2014 fqb27n25tm_f085/ fqi27n25tu_ f085 n-channel mosfet ?2013 fairchild semiconductor corporation fqb27n25tm_f085/qi27n25tu_f085 rev. c1 www.fairchildsemi.com 1 fqb27n25tm_f085/ fqi27n25tu_f085 n-channel mosfet 250v, 25.5a, 131 m features ? typ r ds(on) = 108m at v gs = 10v, i d = 25.5a ? typ q g(tot) = 45nc at v gs = 10v, i d = 27a ? uis capability ? rohs compliant ? qualified to aec q101 applications ? automotive engine control ? powertrain management ? solenoid and motor drivers ? electronic steering ? integrated starter/alternator ? distributed power architectures and vrm ? primary switch for 12v systems mosfet maximum ratings t j = 25c unless otherwise noted symbol parameter ratings units v dss drain to source voltage 250 v v gs gate to source voltage 30 v i d drain current - continuous (v gs =10) (note 1) t c = 25c 25.5 a pulsed drain current t c = 25c see figure3 e as single pulse avalanche energy (note 2) 972 mj p d power dissipation 179 w derate above 25 o c1.43w/ o c t j , t stg operating and storage temperature -55 to + 150 o c r jc thermal resistance junction to case 0.7 o c/w r ja maximum thermal resistance junction to ambient (note 3) 43 o c/w package marking and ordering information device marking device package reel size tape width quantity fqb27n25tm fqb27n25tm_f085 to-263ab 330mm 24mm 800 units fqi27n25tu fqi27n25tu_f085 to-262ab tube n/a 50 units notes: 1: current is limited by bondwire configuration. 2: starting t j = 25c, l = 4.67mh, i as = 20.4a, v dd = 100v during inductor charging and v dd = 0v during time in avalanche 3: r ja is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the s older mounting surface of the drain pins. r jc is guaranteed by design while r ja is determined by the user's boar d design. the maximum rating presented here is based on mounting on a 1 in 2 pad of 2oz copper. g s d to-263ab to-262ab d g s for current package drawing, please refer to the fairchild website at www.fairchildsemi.com/packaging
fqb27n25tm_f085/ fqi27n25tu_ f085 n-channel mosfet fqb27n25tm_f085/qi27n25tu_f085 rev. c1 www.fairchildsemi.com 2 electrical characteristics t j = 25c unless otherwise noted off characteristics on characteristics dynamic characteristics symbol parameter test conditions min typ max units b vdss drain to source breakdown voltage i d = 250 a, v gs = 0v 250 - - v i dss drain to source leakage current v ds = 250v, t j = 25 o c --1 a v gs = 0v t j = 150 o c(note 4) - - 250 ua i gss gate to source leakage current v gs = 30v - - 100 na v gs(th) gate to source threshold voltage v gs = v ds , i d = 250 a 3.0 4.1 5.0 v r ds(on) drain to source on resistance i d = 25.5a, v gs = 10v t j = 25 o c - 108 131 m t j = 150 o c(note 4) - 265 310 m c iss input capacitance v ds = 25v, v gs = 0v, f = 1mhz - 1800 - pf c oss output capacitance - 350 - pf c rss reverse transfer capacitance - 45 - pf r g gate resistance f = 1mhz - 0.82 - q g(tot) total gate charge at 10v v gs = 0 to 10v v dd = 125v i d = 27a -4549nc q g(th) threshold gate charge v gs = 0 to 2v - 3.3 4 nc q gs gate to source gate charge -12-nc q gd gate to drain ?miller? charge - 23 - nc switching characteristics drain-source diode characteristics notes: 4: the maximum value is specified by design at t j = 150c. product is not tested to this condition in production. t on turn-on time v dd = 125v, i d = 27a, v gs = 10v, r gen = 25 - - 196 ns t d(on) turn-on delay time - 36 - ns t r rise time - 122 - ns t d(off) turn-off delay time - 81 - ns t f fall time - 60 - ns t off turn-off time - - 164 ns v sd source to drain diode voltage i sd = 25.5a, v gs = 0v - - 1.5 v i sd = 12.75a, v gs = 0v - - 1.25 v t rr reverse recovery time i f = 27a, di sd /dt = 100a/ s, v dd =200v - 205 238 ns q rr reverse recovery charge - 1.8 2.3 nc
fqb27n25tm_f085/ fqi27n25tu_ f085 n-channel mosfet fqb27n25tm_f085/qi27n25tu_f085 rev. c1 www.fairchildsemi.com 3 typical characteristics figure 1. normalized po wer dissipation vs case temperature 0 25 50 75 100 125 150 0. 0 0. 2 0. 4 0. 6 0. 8 1. 0 1. 2 power dissipation multiplier t c , case temperature( o c) figure 2. 10 -5 10 -4 10 -3 10 -2 10 -1 10 0 10 1 1e-3 0.01 0.1 1 10 single pulse d = 0.50 0.20 0.10 0.05 0.02 0.01 normalized thermal impedance, z t jc t, rectangular pulse duration(s) duty cycle - descending order notes: duty factor: d = t 1 /t 2 peak t j = p dm x z t ja x r t ja + t c p dm t 1 t 2 normalized maximum transient thermal impedance figure 3. peak current capability 10 -5 10 -4 10 -3 10 -2 10 -1 10 0 10 1 1 10 100 1000 v gs = 10v single pulse i dm , peak current (a) t, rectangular pulse duration(s) t c = 25 o c i = i 2 150 - t c 125 for temperatures above 25 o c derate peak current as follows:
fqb27n25tm_f085/ fqi27n25tu_ f085 n-channel mosfet fqb27n25tm_f085/qi27n25tu_f085 rev. c1 www.fairchildsemi.com 4 figure 4. 1 10 100 1000 0.01 0.1 1 10 100 100us 1ms 10ms i d , drain current (a) v ds , drain to source voltage (v) operation in this area may be limited by r ds(on) single pulse t j = max rated t c = 25 o c 100ms forward bias safe operating area 1e-3 0.01 0.1 1 10 100 1000 1 10 100 starting t j = 125 o c starting t j = 25 o c i as , avalanche current (a) t av , time in avalanche (ms) t av = (l)(i as )/(1.3*rated bv dss - v dd ) if r = 0 if r z 0 t av = (l/r)ln[(i as *r)/(1.3*rated bv dss - v dd ) +1] note: refer to fairchild application notes an7514 and an7515 figure 5. unclamped inductive switching c apability figure 6. 24681012 0.1 1 10 100 t j = -55 o c t j = 25 o c t j = 150 o c pulse duration = 80 p s duty cycle = 0.5% max v dd = 20v i d , drain current (a) v gs , gate to source voltage (v) transfer characteristics figure 7. 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1 10 100 200 t j = 25 o c t j = 150 o c v gs = 0 v i s , reverse drain current (a) v sd , body diode forward voltage (v) forward diode characteristics figure 8. 0 4 8 12 16 20 0 20 40 60 80 6v v gs 15v top 10v 8v 7v 6v bottom 80 p s pulse width tj=25 o c i d , drain current (a) v ds , drain to source voltage (v) saturation characteristics figure 9. 048121620 0 20 40 60 5v 5.5v i d , drain current (a) v ds , drain to source voltage (v) v gs 15v top 10v 8v 7v 6v 5.5v 5v bottom 80 p s pulse width tj=150 o c saturation characteristics typical characteristics
fqb27n25tm_f085/ fqi27n25tu_ f085 n-channel mosfet fqb27n25tm_f085/qi27n25tu_f085 rev. c1 www.fairchildsemi.com 5 figure 10. 5678910 0 110 220 330 440 550 i d = 25.5a pulse duration = 80 p s duty cycle = 0.5% max r ds(on) , drain to source on-resistance ( m : ) v gs , gate to source voltage (v) t j = 25 o c t j = 150 o c rdson vs gate voltage figure 11. normalized rdson vs junction te mperature -80 -40 0 40 80 120 160 200 0.6 0.8 1.2 1.6 2.0 2.4 2.8 pulse duration = 80 p s duty cycle = 0.5% max i d = 25.5a v gs = 10v normalized drain to source on-resistance t j , junction temperature ( o c ) figure 12. -80 -40 0 40 80 120 160 200 0.4 0.6 0.8 1.0 1.2 1.4 v gs = v ds i d = 250 p a normalized gate threshold voltage t j , junction temperature( o c) normalized gate threshold voltage vs temperature figure 13. -80 -40 0 40 80 120 160 200 0.8 0.9 1.0 1.1 1.2 i d = 1ma normalized drain to source breakdown voltage t j , junction temperature ( o c) normalized drain to source breakdown voltage vs junction temperature figure 14. 0.1 1 10 100 10 100 1000 10000 f = 1mhz v gs = 0v c rss c oss c iss capacitance (pf) v ds , drain to source voltage ( v ) capacitance vs drain to source voltage figure 15. 0 1020304050 0 2 4 6 8 10 v dd = 120v v dd = 100v i d = 27a v dd = 80v q g , gate charge(nc) v gs , gate to source voltage(v) gate charge vs gate to source voltage typical characteristics
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